Custom Flexible Packaging Solutions For Chips

As a packaging structure, we offer packaging solutions for chips in desired material structures or structures requiring high barrier properties by using two or multi-layer structure combinations. A trusted flexible packaging company to produce your custom chips packaging is key. UCSA Packaging's solutions are designed with convenience and ease of use in mind. They are easy to open, close, and store.

• High barrier
• Low oxygen and water vapor permeability
• Low thermal adhesion
• Protection from light
• High aroma barrier
• High lamination strength
• Sealing capability
• Low COF value
• Matt lacquer application
• Paper touch application

Materials Used

• OPP / METALIZED OPP
• MAT OPP / METALIZED OPP
• PET / METALIZED OPP
• PET / ALU / PE
• PET / METPET / PE